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XC3S400-4FTG256C

Manufacturer Part Number: XC3S400-4FTG256C Manufacturer / Brand: Xilinx
Part of Description: FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA Lead Free Status / RoHS Status: Digital to Analog Converters - DAC Dual, 16-Bit, 1230 MSPS, TxDAC+ Digital-to-Analog Converter
Ship From: HK/Shen Zhen Shipment Way: DHL/Fedex/TNT/UPS
Datasheets:

Product parameters

ManufacturerXilinx
DetailsRoHS
Mounting StyleSMD/SMT
Package / CaseFBGA-256
Minimum Operating Temperature– 0 C
Maximum Operating Temperature+85 C
Embedded Block RAM – EBR288 kbit
Moisture SensitiveYes
Product TypeFPGA – Field Programmable Gate Array
Factory Pack Quantity90
SubcategoryProgrammable Logic ICs
Operating Supply Voltage1.2 V
TradenameSpartan
Unit Weight1 oz

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    SUBMIT INFORMATION

    The XC3S400-4FTG256C is a Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3 family. It offers a combination of high performance, versatility, and reliability, making it suitable for a wide range of digital design applications.

    Key Features

    1. Logic Capacity: The XC3S400-4FTG256C boasts a significant logic capacity, with up to 400,000 gates and 896 Configurable Logic Blocks (CLBs). This provides ample resources for implementing complex digital circuits and systems.
    2. Packaging: Packaged in a Fine-Pitch Ball Grid Array (FBGA-256) with 256 pins, this FPGA offers a compact and reliable solution for integration into various electronic devices and systems.
    3. I/O Options: The XC3S400-4FTG256C provides a versatile set of I/O options, with 173 user-configurable I/O pins. It supports multiple I/O standards, enabling designers to optimize the device for their specific application needs.
    4. Performance: With a maximum operating frequency of 280 MHz, the XC3S400-4FTG256C offers high-speed performance for digital signal processing and other demanding applications.
    5. Memory: The FPGA features 56 kbit of distributed RAM and 288 kbit of embedded block RAM (EBR), providing sufficient memory resources for storing configuration data and temporary variables during operation.
    6. Power Consumption: The XC3S400-4FTG256C operates with a low power consumption, making it suitable for power-sensitive applications.
    7. Configuration Memory: The FPGA’s configuration data is stored in an external non-volatile memory, such as a PROM or Flash memory. After applying power, the configuration data is loaded into the FPGA, programming it to perform the desired digital functions.

    Applications

    Due to its high performance, versatility, and compact packaging, the XC3S400-4FTG256C is suitable for a wide range of applications, including:

    • Telecommunications
    • Data processing
    • Industrial automation
    • Consumer electronics
    • Medical equipment
    • Aerospace and defense

    In summary, the XC3S400-4FTG256C is a high-performance FPGA from Xilinx’s Spartan-3 family that offers significant logic capacity, versatile I/O options, high-speed performance, and low power consumption. Its compact packaging and support for multiple I/O standards make it an excellent choice for a wide range of digital design applications.

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