BCM53724B0KPB
Manufacturer Part Number: BCM53724B0KPB | Manufacturer / Brand: Broadcom |
Part of Description: RF System on a Chip - SoC 9-PORT L2-MANAGED 10/100 | Lead Free Status / RoHS Status: Digital to Analog Converters - DAC Dual, 16-Bit, 1230 MSPS, TxDAC+ Digital-to-Analog Converter |
Ship From: HK/Shen Zhen | Shipment Way: DHL/Fedex/TNT/UPS |
Datasheets:
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Product parameters
Manufacturer | Broadcom |
Details | RoHS |
Mounting Style | SMD/SMT |
Product Type | RF System on a Chip – SoC |
Moisture Sensitive | Yes |
Technology | Si |
Factory Pack Quantity | 1 |
Subcategory | Wireless & RF Integrated Circuits |
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BCM53724B0KPB is an advanced electronic component manufactured by Broadcom, specifically categorized as an integrated circuit (IC). This device belongs to a series of highly integrated and sophisticated switching solutions designed for networking applications. It features robust performance specifications, including a wide operating temperature range from -50°C to 125°C (or -30°C to 90°C, depending on the source), and supports a voltage range from a minimum of 3.5V (or 1V) to a maximum of 8V (or 6V).
BCM53724B0KPB offers exceptional connectivity options, typically providing multiple high-speed interfaces, although the exact number and type may vary based on specific configurations and use cases. Its compact form factor, with dimensions of approximately 3.7mm x 4.3mm x 1.3mm (or 9.1mm x 3.8mm x 2.5mm, depending on the source), allows for easy integration into various networking devices and systems.
Moreover, BCM53724B0KPB complies with RoHS standards, ensuring that it meets environmental regulations related to the restriction of hazardous substances. This component is suitable for a wide range of networking applications, including enterprise networks, data centers, and other high-performance computing environments, where reliable and high-speed data transmission is crucial.
In summary, BCM53724B0KPB is a versatile and high-performance IC designed for networking applications, offering robust performance, compact size, and compliance with environmental standards.