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XC3S200AN-4FTG256I

Manufacturer Part Number: XC3S200AN-4FTG256I Manufacturer / Brand: Xilinx
Part of Description: Field Programmable Gate Array XC3S200AN-4FTG256I Lead Free Status / RoHS Status: table_img Lead free / RoHS Compliant
Ship From: HK/Shen Zhen Shipment Way: DHL/Fedex/TNT/UPS
Datasheets:

Product parameters

ManufacturerXilinx
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseFBGA-256
Embedded Memory288 kbit
Number of I/Os195 I/O
Distributed RAM28 kbit
Minimum Operating Temperature– 40 C
Maximum Operating Temperature+ 100 C
Operating Supply Voltage1 V
Factory Pack Quantity90
SubcategoryProgrammable Logic ICs
TradenameSpartan
Unit Weight0.014110 oz

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    SUBMIT INFORMATION

    The XC3S200AN-4FTG256I is a Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3AN family. It is designed for a wide range of applications, including industrial, automotive, and consumer electronics, offering a balance of performance, power efficiency, and cost-effectiveness. Key features include:

    1. FPGA Family: Part of the Spartan-3AN series, known for combining FPGA logic with non-volatile memory for configuration storage.
    2. Logic Cells: Contains approximately 200,000 system gates, providing ample logic resources for various applications.
    3. Memory: Integrated 288 Kbits of block RAM for data storage and buffering.
    4. Configuration Memory: Includes built-in non-volatile configuration memory, eliminating the need for external configuration storage.
    5. Operating Speed: -4 speed grade, indicating a balance of performance and power consumption.
    6. Package: FTG256, a Fine-Pitch Ball Grid Array (FBGA) with 256 pins, suitable for compact designs.
    7. Temperature Range: Industrial-grade with an operating temperature range of -40°C to 100°C, making it suitable for harsh environments.
    8. I/O Pins: Provides a wide array of I/O options with support for various I/O standards, including LVTTL, LVCMOS, and more.
    9. Embedded Multipliers: Includes hardware multipliers for efficient arithmetic operations.
    10. Power Management: Designed for low power consumption, making it suitable for power-sensitive applications.

    The XC3S200AN-4FTG256I is ideal for applications that require reliable performance in challenging environments, with the added benefit of non-volatile configuration memory, making it a versatile choice for embedded systems, communication devices, and automotive applications.

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