XCKU3P-2FFVA676I

The XCKU3P-2FFVA676I is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Kintex UltraScale+ family. This device offers unparalleled performance, scalability, and efficiency for a wide range of applications, including data center acceleration, aerospace and defense, wired and wireless communications, and industrial automation.

With a robust feature set, the XCKU3P-2FFVA676I provides:

• High Logic Density: The FPGA features a large number of logic elements, DSP slices, and I/O blocks, enabling it to handle complex designs with ease.
• Advanced Interconnect: The device’s high-performance interconnect fabric supports high-speed data transfer between logic elements, ensuring optimal performance for demanding applications.
• Enhanced Memory Options: The XCKU3P-2FFVA676I offers a variety of memory options, including BRAM and UltraRAM, to meet the diverse needs of different applications.
• Hard IP Blocks: The FPGA includes hardened intellectual property (IP) blocks for functions such as PCIe, Ethernet, and serial interfaces, which can significantly reduce design time and complexity.
• Packaging and I/O Flexibility: Packaged in a 676-ball Flip-Chip BGA, the XCKU3P-2FFVA676I supports a wide range of I/O standards and signaling rates, making it versatile for different types of interfaces and connectors.
• Power Efficiency: The Kintex UltraScale+ family is known for its power-efficient architecture, which enables the XCKU3P-2FFVA676I to deliver high performance while consuming less power.

In summary, the XCKU3P-2FFVA676I is a versatile and powerful FPGA that combines high performance, scalability, and efficiency in a compact package. Its advanced features make it an ideal choice for demanding applications that require complex logic, high-speed data transfer, and robust connectivity options.